Single-crystal diamond polishing slurry: Single-crystal diamond polishing slurry possesses excellent cutting force and relatively low processing cost. It is widely applicable to the grinding and polishing of superhard materials, cemented carbide, and other hard materials. It can both increase the grinding rate and rapidly dissipate the large amount of heat generated during grinding, thus preventing burns to the workpiece surface.
Polycrystalline diamond polishing slurry: Polycrystalline diamond polishing slurry utilizes the good toughness of polycrystalline diamond, maintaining high grinding force while minimizing scratches during grinding and polishing, providing excellent conditions for subsequent precision polishing. It is widely used for grinding and polishing various hard materials such as optical crystals, ceramics, and superhard alloys.
Nanodiamond polishing slurry: Nanodiamond polishing slurry is made by uniformly dispersing detonated diamond micropowder in water. It has good dispersion stability and is widely applicable to ultra-precision polishing. Optical glass and gemstones have extremely high requirements for processing precision, and nanodiamond polishing slurry can form a high-quality processed surface while maintaining a high grinding rate.
Applications of CMP polishing slurry: LED Industry: Currently, the main substrate material used for LED chips is sapphire, which requires thinning and polishing during processing. Sapphire has extremely high hardness, making it difficult to process with ordinary abrasives. After thinning and rough grinding the surface of a sapphire substrate with diamond polishing slurry, some scratches of varying sizes are inevitable. CMP polishing slurry utilizes the principle of "soft abrasion of hard" to achieve precise polishing of the sapphire surface. With the rapid development of the LED industry, the demand for polycrystalline diamond polishing slurry and silica sol polishing slurry is also increasing daily.
In the semiconductor industry, CMP technology is also widely used for polishing silicon wafers as the substrate material in integrated circuits (ICs) and ultra-large-scale integrated circuits (ULSI). With the rapid development of the semiconductor industry, new requirements have been placed on polishing technology. Traditional polishing techniques (such as selective deposition and sputtering based on deposition techniques) can provide a "smooth" surface, but these are only local planarization techniques and cannot achieve global planarization. Chemical mechanical polishing (CMP) technology solves this problem; it is currently the only process technology that can achieve complete planarization across the entire silicon wafer.