Metal Polishing Slurry

Metal Polishing Slurry

Colloidal Silica Metal Polishing Slurry
Particle Size Options: 30–190 nm
SiO₂ Content Options: 30–50%
Fine, Intermediate and Stock-Removal Grades
Customizable pH Range: 3–11
Metal-Specific Formulation Support
Shelf Life: ≥12 Months

Shandong Peak-tech New Material Co., Ltd. is one of the most reliable manufacturers and suppliers of metal polishing slurry in China. With a professional production team, we are able to meet the needs of the majority of our customers. Welcome to buy durable metal polishing slurry for sale here from our factory.

 

Technical Data

Colloidal Silica Grades for Metal Polishing Slurry

Metal polishing slurry uses controlled silica particles as an abrasive phase within substrate-specific chemistry. Aluminum, stainless steel, copper alloys, nickel alloys and coated metals require different pH, oxidizer, complexant and inhibitor strategies, even when the same silica size is initially screened.

Model Particle Size SiO₂ Content Na₂O Content pH Shelf Life
LS30 30–40 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS50 50–60 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS80 80–90 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS100 100–110 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS120 110–120 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS150 140–160 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS180 170–190 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months

The LS grades are abrasive candidates for metal polishing slurry development, not universal finished compounds. Confirm particle distribution, oversized particles, pH, surface chemistry and polishing performance on the actual metal. One formulation should not be assumed suitable for every alloy.

Polishing Grade Selection

Match Particle Size to Removal and Surface-Finish Targets

30–60 nm

LS30 and LS50

Finer LS options for final-polishing trials prioritizing low roughness and reduced scratch risk under compatible chemistry.

80–120 nm

LS80, LS100 and LS120

Intermediate particle ranges for balancing metal removal, surface roughness, brightness and defect control.

140–190 nm

LS150 and LS180

Larger candidates for stock-removal trials, subject to strict control of scratches, embedded particles and surface defects.

Customizable

pH 3–11

The pH can be reviewed after alloy compatibility, surface compatibility, target value and tolerance are defined.

Specification Confirmation

Information Needed for Metal Polishing

Connect the abrasive specification with the alloy, polishing stage, equipment and required surface quality.

  • Metal substrate: identify alloy family and grade, hardness, dimensions, initial roughness, weld, plating or coating condition.
  • Polishing stage: specify stock removal, intermediate polishing, final polishing or another process step.
  • Particle specification: provide nominal size, distribution, oversized-particle limit, agglomerate limit and test method.
  • Slurry chemistry: state SiO₂ content, target pH, additives, dilution water and permitted sodium level.
  • Performance targets: define removal rate, roughness, flatness, gloss or brightness, scratches, pits, corrosion or staining, residue and post-treatment requirements.
  • Order details: include equipment, pad, trial quantity, annual demand, packaging and destination country.

Request a Metal Polishing Slurry Trial Grade

Send the metal grade, hardness, polishing stage, target particle size, slurry chemistry, removal rate and surface-quality requirements.

Request a Polishing Slurry Recommendation
Packaging and Storage

Protect Product Stability During Storage

Packaging Options

Available polyethylene packaging sizes are 25 kg, 250 kg and 1000 kg.

Storage Temperature

Store at 0–40°C and protect from freezing. Temperatures below 0°C can cause irreversible gelation.

Direct Sunlight

Avoid prolonged exposure to direct sunlight during storage and transportation.

Container Closure

Keep containers closed to limit water evaporation and precipitation of solid silica particles.

FAQ

Metal Polishing Slurry Questions

Which colloidal silica grades can be evaluated for metal polishing slurry?

The standard grades are LS30, LS50, LS80, LS100, LS120, LS150 and LS180.

What particle-size range is available for polishing trials?

The published grade ranges start at 30–40 nm and extend to 170–190 nm.

Can the pH be customized?

Yes. The pH is listed as customizable within 3–11, subject to final specification confirmation.

Which polishing results should be validated?

Validate removal rate, surface roughness, flatness, brightness, scratches, pits, residue, slurry stability and lot-to-lot consistency.

How should metal polishing colloidal silica be stored?

Store it at 0–40°C, prevent freezing and direct sunlight, and keep the container closed.

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Applications

Metal Polishing Slurry Applications

LS grades can be evaluated as abrasive candidates for metal polishing. Qualification requires metal-specific tests for removal rate, roughness, brightness, scratches, pits, residue and slurry stability.

Copper and Nickel Alloys

Evaluated only with metal-specific oxidizer, inhibitor and complexant chemistry after removal and corrosion behavior are qualified.

Aluminum Alloy Components

Candidate chemistry can be developed for aluminum alloy parts with defined finish, corrosion and defect targets.

Stainless Steel Components

Can be assessed for stainless components after grade, hardness, dimensional and surface-integrity requirements are defined.

Mold and Tool Surfaces

Can be evaluated for molds requiring controlled roughness, gloss and resistance to scratches or pits.

Pre-Coating Surface Preparation

Selected particle ranges may be tested for surface preparation before plating, coating or passivation, subject to downstream compatibility.

Custom Metal Slurries

Supports development around a defined metal grade, LS grade, oversized-particle limit, additives and controlled pH.