Ceramic Polishing Slurry

Ceramic Polishing Slurry

Colloidal Silica Ceramic Polishing Slurry
Particle Size Options: 30–190 nm
SiO₂ Content Options: 30–50%
Fine, Intermediate and Stock-Removal Grades
Customizable pH Range: 3–11
Surface Roughness and Defect Control Support
Shelf Life: ≥12 Months

Shandong Peak-tech New Material Co., Ltd. is one of the most reliable manufacturers and suppliers of ceramic polishing slurry in China. With a professional production team, we are able to meet the needs of the majority of our customers. Welcome to buy durable ceramic polishing slurry for sale here from our factory.

 

Technical Data

Colloidal Silica Grades for Ceramic Polishing Slurry

Ceramic polishing slurry combines controlled silica particles with application-specific chemistry for precision finishing of alumina, zirconia, silicon nitride and other compatible technical ceramics. Selection should reflect ceramic composition, density, hardness, grain structure, initial roughness, polishing stage, pad and target finish.

Model Particle Size SiO₂ Content Na₂O Content pH Shelf Life
LS30 30–40 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS50 50–60 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS80 80–90 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS100 100–110 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS120 110–120 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS150 140–160 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months
LS180 170–190 nm 30–50% ≤0.4% 9.5–10.5 ≥12 months

The LS grades are abrasive candidates for ceramic polishing slurry development, not finished polishing compounds. Confirm particle distribution, oversized-particle limits and polishing performance through trials.

Polishing Grade Selection

Match Particle Size to the Required Finish

30–60 nm

LS30 and LS50

Finer LS options for polishing trials prioritizing surface finish and lower scratch risk under compatible slurry conditions.

80–120 nm

LS80, LS100 and LS120

Intermediate particle ranges for balancing material-removal rate, surface roughness and defect control.

140–190 nm

LS150 and LS180

Larger candidates for trials requiring higher removal action, subject to strict scratch and oversized-particle control.

Customizable

pH 3–11

The pH can be reviewed within the published customizable range after the target value and tolerance are provided.

Specification Confirmation

Information Needed for Ceramic Polishing

Connect the abrasive specification with ceramic composition, microstructure, polishing stage, equipment and required surface quality.

  • Ceramic substrate: identify composition, grade, density, hardness, grain structure, dimensions, initial roughness and prior processing.
  • Polishing stage: specify stock removal, intermediate polishing, final polishing or another process step.
  • Particle specification: provide nominal size, distribution, oversized-particle limit, agglomerate limit and test method.
  • Slurry chemistry: state SiO₂ content, target pH, additives, dilution water and permitted sodium level.
  • Performance targets: define removal rate, surface roughness, flatness, haze, scratches, pits, edge damage and defect limits.
  • Order details: include equipment, pad, trial quantity, annual demand, packaging and destination country.

Request a Ceramic Polishing Trial Grade

Send the ceramic composition, grade, component format, polishing stage, target particle size, slurry chemistry, removal-rate and surface-quality requirements.

Request a Ceramic Slurry Recommendation
Packaging and Storage

Protect Product Stability During Storage

Packaging Options

Available polyethylene packaging sizes are 25 kg, 250 kg and 1000 kg.

Storage Temperature

Store at 0–40°C and protect from freezing. Temperatures below 0°C can cause irreversible gelation.

Direct Sunlight

Avoid prolonged exposure to direct sunlight during storage and transportation.

Container Closure

Keep containers closed to limit water evaporation and precipitation of solid silica particles.

FAQ

Ceramic Polishing Slurry Questions

Which colloidal silica grades can be evaluated for ceramic polishing?

The standard grades are LS30, LS50, LS80, LS100, LS120, LS150 and LS180.

What particle-size range is available for polishing trials?

The published grade ranges start at 30–40 nm and extend to 170–190 nm.

Can the pH be customized?

Yes. The pH is listed as customizable within 3–11, subject to final specification confirmation.

Which polishing results should be validated?

Validate removal rate, surface roughness, flatness, haze, scratches, pits, defect density, slurry stability and lot-to-lot consistency.

How should ceramic polishing colloidal silica be stored?

Store it at 0–40°C, prevent freezing and direct sunlight, and keep the container closed.

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Applications

Ceramic Polishing Slurry Applications

LS grades can be evaluated as abrasive candidates in ceramic polishing slurries. Select the particle range by polishing stage and validate removal rate, surface quality, defects and slurry stability in the actual process.

Alumina Ceramic Polishing

Evaluated for alumina substrates and components after grade, density, particle distribution and defect targets are defined.

Zirconia Ceramic Polishing

Candidate grades can be tested for zirconia components requiring controlled roughness, gloss and defect performance.

Silicon Nitride Components

Can be assessed for compatible silicon nitride components with defined flatness and surface-integrity limits.

Technical Ceramic Seals

Can be evaluated for seal faces and wear components after geometry, flatness and finish targets are defined.

Ceramic Wafer and Substrate Finishing

Selected particle ranges may be evaluated for ceramic wafers and substrates under controlled slurry and pad conditions.

Custom Ceramic Slurries

Supports development requiring a defined LS grade, controlled oversized particles, selected additives and a target pH within 3–11.