Polishing slurries can be broadly categorized by their main components into several types: diamond polishing slurries (polycrystalline diamond, monocrystalline diamond, and nanocrystalline diamond), silicon dioxide polishing slurries (CMP polishing slurries), cerium oxide polishing slurries, alumina polishing slurries, and silicon carbide polishing slurries.
Polycrystalline Diamond Polishing Slurries: Polycrystalline diamond polishing slurries use polycrystalline diamond micropowder as their main component, combined with a highly dispersible formula, which can maintain a high cutting rate while minimizing scratches on the polishing material.
They are primarily used for polishing sapphire substrates, back-side thinning of LED chips, optical crystals, and hard drive heads.
Silicon Oxide Polishing Slurries: Silicon dioxide polishing slurries (CMP polishing slurries) are high-purity, low-metal-ion polishing products produced using high-purity silicon powder through a special process.
They are widely used for nanoscale high-planarity polishing of various materials, such as silicon wafers, germanium wafers, compound semiconductor materials like gallium arsenide and indium phosphide, precision optical devices, and sapphire wafers.
Cerium Oxide Polishing Slurry: This cerium oxide polishing slurry uses micron- or submicron-sized CeO2 as abrasive. It features good dispersibility, fine particle size, uniform particle size distribution, and moderate hardness.
Suitable for precision polishing of high-precision optical instruments, optical lenses, microcrystalline glass substrates, crystal surfaces, and integrated circuit photomasks.
Alumina and Silicon Carbide Polishing Slurry: This polishing slurry uses ultrafine alumina and silicon carbide micropowder as abrasives, primarily composed of micron- or submicron-sized abrasives.
Mainly used for grinding and polishing high-precision optical instruments, hard disk substrates, magnetic heads, ceramics, and fiber optic connectors.